Patent Assignment
Reel/Frame 068142/0597
Assignment of Assignor's Interest
Recorded: 2024-07-31
Pages: 6
Assignees
ISABERS JAPAN CO. LTD.
NITTOCHI-NISHI-SHINJUKU-BUILDING 8F, 6-10-1, NISHI-SHINJUKU, SHINJUKU-KU, TOKYO, 160-0023, JAPAN
SUGA, TADATOMO
6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU, TOKYO, 164-0003, JAPAN
Covered Properties
(4)
Bonding-Substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-Substrate Fabrication Apparatus, and Substrate Assembly
Method for Bonding Polymer Film and Polymer Film, Method for Bonding Polymer Film and Inorganic Material Substrate, Polymer Film Laminate, and Laminate of Polymer Film and Inorganic Material Substrate
Electronic Element Sealing Method and Bonded Substrate
Thin Substrate, Method for Manufacturing Same, and Method for Transporting Substrate
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2013
From: SUGA, TADATOMO; YAMAUCHI, AKIRA; KONDOU, RYUICHI; MATSUMOTO, YOSHIIE
To: BONDTECH CO., LTD.,; TAIYO YUDEN CO., LTD.,; LAN TECHNICAL SERVICE CO., LTD.,; SUGA, TADATOMO
Reel/Frame 031427/0226 →
Assignment of Assignor's Interest
Oct 9, 2014
From: MATSUMOTO, YOSHIIE
To: LAN TECHNICAL SERVICE CO., LTD.
Reel/Frame 033923/0654 →
Assignment of Assignor's Interest
Dec 12, 2014
From: MATSUMOTO, YOSHIIE
To: LAN TECHNICAL SERVICE CO., LTD.
Reel/Frame 034495/0462 →
Assignment of Assignor's Interest
Jan 12, 2017
From: MATSUMOTO, YOSHIIE
To: LAN TECHNICAL SERVICE CO., LTD.
Reel/Frame 040960/0488 →
Assignment of Assignor's Interest
Nov 12, 2018
From: BONDTECH CO., LTD.; TAIYO YUDEN CO., LTD.; LAN TECHNICAL SERVICE CO., LTD.; SUGA, TADATOMO
To: LAN TECHNICAL SERVICE CO., LTD.; SUGA, TADATOMO
Reel/Frame 047503/0175 →