Patent Assignment
Reel/Frame 031427/0226
Assignment of Assignor's Interest
Recorded: 2013-10-17
Pages: 14
Assignors
SUGA, TADATOMO
Executed: 2013-08-30
YAMAUCHI, AKIRA
Executed: 2013-08-30
KONDOU, RYUICHI
Executed: 2013-09-11
MATSUMOTO, YOSHIIE
Executed: 2013-08-30
Assignees
BONDTECH CO., LTD.,
1-25, NISHINOHATA OKUBO-CHO, UJI-SHI, KYOTO, JAPAN
TAIYO YUDEN CO., LTD.,
16-20, UENO 6-CHOME, TAITO-KU, TOKYO, JAPAN
LAN TECHNICAL SERVICE CO., LTD.,
38-2, YOYOGI 1-CHOME, SHIBUYA-KU, TOKYO, JAPAN
SUGA, TADATOMO
6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU, TOKYO, JAPAN
Covered Property
(1)
Bonding-Substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-Substrate Fabrication Apparatus, and Substrate Assembly
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 12, 2018
From: BONDTECH CO., LTD.; TAIYO YUDEN CO., LTD.; LAN TECHNICAL SERVICE CO., LTD.; SUGA, TADATOMO
To: LAN TECHNICAL SERVICE CO., LTD.; SUGA, TADATOMO
Reel/Frame 047503/0175 →
Assignment of Assignor's Interest
Jul 31, 2024
From: LAN TECHNICAL SERVICE CO., LTD.; SUGA, TADATOMO
To: ISABERS JAPAN CO. LTD.; SUGA, TADATOMO
Reel/Frame 068142/0597 →