Patent Assignment
Reel/Frame 047503/0175
Assignment of Assignor's Interest
Recorded: 2018-11-12
Pages: 14
Assignors
BONDTECH CO., LTD.
Executed: 2018-11-05
TAIYO YUDEN CO., LTD.
Executed: 2018-11-09
LAN TECHNICAL SERVICE CO., LTD.
Executed: 2018-11-09
SUGA, TADATOMO
Executed: 2018-11-12
Assignees
LAN TECHNICAL SERVICE CO., LTD.
38-2, YOYOGI 1-CHOME, SHIBUYA-KU, TOKYO, 151-0053, JAPAN
SUGA, TADATOMO
6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU, TOKYO, 164-0003, JAPAN
Covered Property
(1)
Bonding-Substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-Substrate Fabrication Apparatus, and Substrate Assembly
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2013
From: SUGA, TADATOMO; YAMAUCHI, AKIRA; KONDOU, RYUICHI; MATSUMOTO, YOSHIIE
To: BONDTECH CO., LTD.,; TAIYO YUDEN CO., LTD.,; LAN TECHNICAL SERVICE CO., LTD.,; SUGA, TADATOMO
Reel/Frame 031427/0226 →
Assignment of Assignor's Interest
Jul 31, 2024
From: LAN TECHNICAL SERVICE CO., LTD.; SUGA, TADATOMO
To: ISABERS JAPAN CO. LTD.; SUGA, TADATOMO
Reel/Frame 068142/0597 →