IP Library Assignment 034509/0746
Patent Assignment
Reel/Frame 034509/0746

Assignment of Assignor's Interest

Recorded: 2014-12-15 Pages: 3
Assignor
RATHBURN, JAMES
Executed: 2014-12-12
Assignee
HSIO TECHNOLOGIES, LLC
13300 67TH AVENUE NORTH, MAPLE GROVE, MINNESOTA, 55311
Covered Property (1)
Hybrid Printed Circuit Assembly with Low Density Main Core and Embedded High Density Circuit Regions
Patent: 9,699,906 →
Application: 14/408,205 →
Publication: US 2015/0181710
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 31, 2023
From: HSIO TECHNOLOGIES, LLC
To: LCP MEDICAL TECHNOLOGIES, LLC
Reel/Frame 063802/0408 →