Patent Assignment
Reel/Frame 063802/0408
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 6
Assignor
HSIO TECHNOLOGIES, LLC
Executed: 2023-05-10
Assignee
LCP MEDICAL TECHNOLOGIES, LLC
11795 TILTON TRAIL N., ROGERS, MINNESOTA, 55374
Covered Properties
(7)
High Performance Electrical Circuit Structure
Direct Metalization of Electrical Circuit Structures
Hybrid Printed Circuit Assembly with Low Density Main Core and Embedded High Density Circuit Regions
Fusion Bonded Liquid Crystal Polymer Circuit Structure
Fusion Bonded Liquid Crystal Polymer Electrical Circuit Structure
Hybrid Printed Circuit Assembly with Low Density Main Core and Embedded High Density Circuit Regions
Method of Making a Fusion Bonded Circuit Structure
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 16, 2013
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 030227/0438 →
Assignment of Assignor's Interest
Feb 12, 2014
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 032206/0774 →
Assignment of Assignor's Interest
Dec 15, 2014
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 034509/0746 →
Assignment of Assignor's Interest
Sep 24, 2015
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 036649/0474 →
Assignment of Assignor's Interest
Mar 15, 2016
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 037975/0997 →
Assignment of Assignor's Interest
May 31, 2017
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 042534/0742 →
Assignment of Assignor's Interest
Dec 14, 2017
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 044400/0762 →