Patent Assignment
Reel/Frame 042534/0742
Assignment of Assignor's Interest
Recorded: 2017-05-31
Pages: 3
Assignor
RATHBURN, JAMES
Executed: 2017-05-30
Assignee
HSIO TECHNOLOGIES, LLC
13400 68TH AVENUE NORTH, MAPLE GROVE, MINNESOTA, 55311
Covered Property
(1)
Hybrid Printed Circuit Assembly with Low Density Main Core and Embedded High Density Circuit Regions
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.