Patent Assignment
Reel/Frame 034529/0665
Assignment of Assignor's Interest
Recorded: 2014-12-17
Pages: 4
Assignors
YAMAGUCHI, HIROYUKI
Executed: 2014-11-07
KURIHARA, SEIICHI
Executed: 2014-11-07
SAKURAI, HIROSHI
Executed: 2014-11-07
NUKINA, SHUNSUKE
Executed: 2014-10-30
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Multilayer Wiring Board with Metal Foil Wiring Layer, Wire Wiring Layer, and Interlayer Conduction Hole
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 9, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059355/0743 →
Demerger
Jun 14, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 060281/0643 →
Merger
Feb 3, 2023
From: LINCSTECH CO., LTD.
To: PTCJ-S HOLDINGS, CO., LTD.
Reel/Frame 062585/0259 →
Change of Name
Feb 3, 2023
From: PTCJ-S HOLDINGS, CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 062585/0300 →