Patent Assignment
Reel/Frame 062585/0300
Change of Name
Recorded: 2023-02-03
Pages: 12
Assignor
PTCJ-S HOLDINGS, CO., LTD.
Executed: 2022-10-01
Assignee
LINCSTECH CO., LTD.
14-1, KYOBASHI 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Properties
(12)
Chip-Type Light Emitting Device and Wiring Substrate for the Same
Multilayer Wiring Board with Metal Foil Wiring Layer, Wire Wiring Layer, and Interlayer Conduction Hole
Multilayer Wiring Board
Multilayr Wiring Board, and Method for Manufacturing Multilayer Wiring Board
Layered Body with Support Substrate, Method for Fabricating Same, and Method for Fabricating Multi-Layer Wiring Substrate
Method for Manufacturing Multilayer Wiring Substrate
An Insulated Coated Wire Having a Wire Coating Layer of a Resin Surrounded by a Wire Adhesive Layer of a Resin
Method for Manufacturing Multilayer Wiring Substrate
Method for Manufacturing Multilayer Wiring Substrate
Multilayer Wiring Board and Method for Manufacturing Same
Multi-Wire Wiring Board
Method for Manufacturing Multilayer Wiring Board
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 29, 2008
From: NISHIDA, TAKANORI; ISODA, SATOSHI; SUGIURA, RYOUJI; SAKURAI, MASAYUKI
To: HITACHI AIC INC.
Reel/Frame 021598/0313 →
Assignment of Assignor's Interest
Dec 17, 2014
From: YAMAGUCHI, HIROYUKI; KURIHARA, SEIICHI; SAKURAI, HIROSHI; NUKINA, SHUNSUKE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 034529/0665 →
Assignment of Assignor's Interest
Dec 29, 2014
From: KATOU, MASAHIRO; KOSHIKAWA, YASUYUKI; WADA, HIROSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 034712/0889 →
Assignment of Assignor's Interest
Oct 15, 2015
From: NISHIDA, TAKANORI; USHIYAMA, YUJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 036802/0265 →
Assignment of Assignor's Interest
Oct 26, 2015
From: HATAZAWA, HIROKI
To: HITACHI CHEMICAL COMPANY, LTD
Reel/Frame 036883/0332 →
Assignment of Assignor's Interest
Oct 28, 2015
From: YOSHIDA, NOBUYUKI
To: HITACHI CHEMICAL COMPANY, LTD
Reel/Frame 036901/0889 →
Assignment of Assignor's Interest
May 10, 2016
From: YOSHIDA, NOBUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 038529/0720 →
Assignment of Assignor's Interest
May 10, 2016
From: YOSHIDA, NOBUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 038529/0691 →
Assignment of Assignor's Interest
May 10, 2016
From: YOSHIDA, NOBUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 038529/0748 →
Assignment of Assignor's Interest
Jun 26, 2017
From: YAMAGUCHI, HIROYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042810/0644 →
Assignment of Assignor's Interest
Oct 3, 2017
From: YOSHIDA, NOBUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 043771/0022 →
Assignment of Assignor's Interest
Mar 8, 2018
From: YAMAGUCHI, HIROYUKI; OGINO, HARUO; KURIHARA, SEIICHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045140/0556 →
Change of Name
Mar 9, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059355/0743 →
Assignment of Assignor's Interest
Mar 22, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 059339/0621 →
Merger
Mar 22, 2022
From: SHOWA DENKO MATERIALS ELECTRONICS CO.,LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059471/0737 →
Change of Name
Mar 22, 2022
From: HITACHI CHEMICAL ELECTRONICS CO., LTD.
To: SHOWA DENKO MATERIALS ELECTRONICS CO.,LTD.
Reel/Frame 059471/0614 →
Change of Name
Mar 22, 2022
From: HITACHI AIC INC.
To: HITACHI CHEMICAL ELECTRONICS CO., LTD.
Reel/Frame 059471/0471 →
Demerger
Jun 14, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 060281/0643 →
Merger
Feb 3, 2023
From: LINCSTECH CO., LTD.
To: PTCJ-S HOLDINGS, CO., LTD.
Reel/Frame 062585/0259 →