Multilayer wiring board
A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.
1. A multilayer wiring board comprising:
a core material having an insulating layer, a first ground pattern disposed on one side of the insulating layer, and a strip line disposed on the other side of the insulating layer;
a prepreg disposed on the strip line of the core material, the prepreg comprising a reinforcement material and an insulating resin impregnated in the reinforcement material; and
a second ground pattern disposed on the prepreg,
wherein the insulating layer of the core material comprises a high frequency-adaptive base material, and the prepreg comprises a general-purpose base material, and
wherein a relative permittivity after curing and a dielectric loss tangent of the general-purpose base material of the prepreg are respectively higher than a relative permittivity after curing and a dielectric loss tangent of the high frequency-adaptive base material.
2. The multilayer wiring board according to claim 1 ,
wherein the high frequency-adaptive base material is a base material having relative permittivity of less than 4.00 and a dielectric loss tangent of less than 0.0100.
3. The multilayer wiring board according to claim 1 ,
wherein the general-purpose base material is a base material having relative permittivity after curing of 4.20 or greater and a dielectric loss tangent of 0.0130 or greater.
4. The multilayer wiring board according to claim 1 , further comprising a through-hole that penetrates through the core material, the prepreg and the second ground pattern.
5. The multilayer wiring board according to claim 1 ,
wherein the prepreg includes a fiber-like reinforcement material.
6. The multilayer wiring board according to claim 1 ,
wherein the prepreg includes a reinforcement material comprising at least one of paper, glass fiber and aramid fiber.
7. The multilayer wiring board according to claim 1 ,
wherein the prepreg includes a reinforcement material comprising at least one of paper, a woven fabric and a non-woven fabric.
8. The multilayer wiring board according to claim 1 ,
wherein a bottom face of the strip line is disposed at a side of the insulating layer configured to include the high frequency-adaptive base material.
9. The multilayer wiring board according to claim 1 ,
wherein the strip line has a protruding shape toward a side of the prepreg.
10. The multilayer wiring board according to claim 1 ,
wherein surface roughness of a bottom face of the strip line is greater than surface roughness of a surface of the strip line.
11. The multilayer wiring board according to claim 1 ,
wherein an area where a bottom face of the strip line contacts the insulating layer is equal to or larger than an area where a surface of the strip line contacts the prepreg.
12. The multilayer wiring board according to claim 1 ,
wherein a ratio of a thickness between the core material and the prepreg is any ratio from 1:4 to 5:1.
13. The multilayer wiring board according to claim 1 ,
wherein a ratio between a line width and a thickness of the strip line is any ratio from 1:1 to 15:1.