Multi-wire wiring board
A multi-wire wiring board including insulation-coated wires each including a wire and a wire coating layer, and a wire-laying adhesive sheet on which the insulation-coated wires are wire-laid, in which the multi-wire wiring board includes a wire-laying adhesive sheet on which a high-frequency-compatible wire is disposed, the high-frequency-compatible wire including the wire coating layer being a low-dielectric resin having a relative permittivity less than 3.6 at 10 GHz, and a wire-laying adhesive sheet on which a general wire is disposed, the general wire including the wire coating layer being a general resin having a relative permittivity of 3.6 or more at 10 GHz.
1. A multi-wire wiring board comprising:
a wiring adhesive sheet;
a first insulated wire provided on the wiring adhesive sheet, the first insulated wire comprising a first wire, a first coating layer surrounding the first wire, the first coating layer comprising a low-dielectric resin having a relative permittivity less than 3.6 at 10 GHz, and a first adhesive layer surrounding the first coating layer;
a second insulated wire provided on the wiring adhesive sheet, the second insulated wire comprising a second wire, a second coating layer surrounding the second wire, the second coating layer comprising a general resin having a relative permittivity of 3.6 or more at 10 GHz, and a second adhesive layer surrounding the second coating layer; and
a prepreg that covers the first and second insulated wires,
wherein the first insulated wire and the second insulated wire are arranged on the wiring adhesive sheet to cross each other at a crossing point so as to define a void between the first insulated wire and the second insulated wire adjacent the crossing point.
2. The multi-layer wiring board of claim 1 , wherein the first insulated wire is disposed under the second insulated wire in a region in which the first and second insulated wires cross each other such that the second insulated wire is bent more than the first insulated wire in region in which the second insulated wire crosses over the first insulated wire.
3. The multi-layer wiring board of claim 1 , wherein the wiring adhesive sheet has two or more types of characteristic impedances.
4. The multi-layer wiring board of claim 1 , wherein the first coating layer comprises one or a combination of two or more of a fluorine resin, a polyamide imide resin, and a low-dielectric polyimide resin with a relative permittivity less than 3.6 at 10 GHz.
5. The multi-wire wiring board according to claim 1 ,
wherein a strength of the first coating layer is lower than a strength of the second coating layer.
6. The multi-wire wiring board according to claim 1 ,
wherein the first and second insulated wires are arranged on the wiring adhesive sheet so as to have portions parallel each other.
7. The multi-wire wiring board according to claim 1 ,
wherein the first insulated wire is disposed on the wiring adhesive sheet in a state in which the first insulated wire is hardly bent.
8. The multi-wire wiring board according to claim 1 ,
wherein the first adhesive layer comprises one or a combination of two or more of a fluorine resin, a polyamide imide resin, and a low-dielectric polyimide resin with a relative permittivity less than 3.6 at 10 GHz.
9. The multi-wire wiring board according to claim 1 ,
Wherein the wire adhesive sheet is arranged on an internal layer substrate through an underlay layer.
10. The multi-wire wiring board according to claim 1 ,
further comprising a through-hole that penetrates the multi-wire wiring board.
11. The multi-wire wiring board according to claim 10 ,
wherein the first insulated wire does not connect the through-hole.
12. The multi-wire wiring board according to claim 10 ,
wherein the first insulated wire connects the through-hole.
13. A multi-wire wiring board comprising:
a wiring adhesive sheet;
a first insulated wire provided on the wiring adhesive sheet, the first insulated wire comprising a first wire, a first coating layer surrounding the first wire, the first coating layer comprising a low-dielectric resin having a relative permittivity less than 3.6 at 10 GHz, and a first adhesive layer surrounding the first coating layer; and
a second insulated wire provided on the wiring adhesive sheet, the second insulated wire comprising a second wire, a second coating layer surrounding the second wire, the second coating layer comprising a general resin having a relative permittivity of 3.6 or more at 10 GHz, and a second adhesive layer surrounding the second coating layer;
wherein the first insulated wire and the second insulated wire are arranged on the on the wiring adhesive sheet to cross each other at a crossing point so as to define a void between the first insulated wire and the second insulated wire adjacent the crossing point.
14. The multi-layer wiring board of claim 13 , wherein the first insulated wire is disposed under the second insulated wire in a region in which the first and second insulated wires cross each other such that the second insulated wire is bent more than the first insulated wire in region in which the second insulated wire crosses over the first insulated wire.
15. The multi-layer wiring board of claim 13 , wherein the wiring adhesive sheet has two or more types of characteristic impedances.
16. The multi-layer wiring board of claim 13 , wherein the first coating layer comprises one or a combination of two or more of a fluorine resin, a polyamide imide resin, and a low-dielectric polyimide resin with a relative permittivity less than 3.6 at 10 GHz.
17. The multi-wire wiring board according to claim 13 ,
wherein a strength of the first coating layer is lower than a strength of the second coating layer.
18. The multi-wire wiring board according to claim 13 ,
wherein the first insulated wire is disposed on the wiring adhesive sheet in a state in which the first insulated wire is hardly bent.
19. The multi-wire wiring board according to claim 13 ,
wherein the first adhesive layer comprises one or a combination of two or more of a fluorine resin, a polyamide imide resin, and a low-dielectric polyimide resin with a relative permittivity less than 3.6 at 10 GHz.
20. The multi-wire wiring board according to claim 13 ,
further comprising a through-hole that penetrates the multi-wire wiring board.