Patent Assignment
Reel/Frame 036883/0332
Assignment of Assignor's Interest
Recorded: 2015-10-26
Pages: 2
Assignor
HATAZAWA, HIROKI
Executed: 2015-07-07
Assignee
HITACHI CHEMICAL COMPANY, LTD
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Layered Body with Support Substrate, Method for Fabricating Same, and Method for Fabricating Multi-Layer Wiring Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 9, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059355/0743 →
Demerger
Jun 14, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 060281/0643 →
Merger
Feb 3, 2023
From: LINCSTECH CO., LTD.
To: PTCJ-S HOLDINGS, CO., LTD.
Reel/Frame 062585/0259 →
Change of Name
Feb 3, 2023
From: PTCJ-S HOLDINGS, CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 062585/0300 →