Patent Assignment
Reel/Frame 059471/0471
Change of Name
Recorded: 2022-03-22
Pages: 13
Assignor
HITACHI AIC INC.
Executed: 2009-10-01
Assignee
HITACHI CHEMICAL ELECTRONICS CO., LTD.
413, KUGETA, MOOKA-SHI, TOCHIGI, JAPAN
Covered Property
(1)
Chip-Type Light Emitting Device and Wiring Substrate for the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 29, 2008
From: NISHIDA, TAKANORI; ISODA, SATOSHI; SUGIURA, RYOUJI; SAKURAI, MASAYUKI
To: HITACHI AIC INC.
Reel/Frame 021598/0313 →
Assignment of Assignor's Interest
Mar 22, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 059339/0621 →
Change of Name
Mar 22, 2022
From: HITACHI CHEMICAL ELECTRONICS CO., LTD.
To: SHOWA DENKO MATERIALS ELECTRONICS CO.,LTD.
Reel/Frame 059471/0614 →
Merger
Mar 22, 2022
From: SHOWA DENKO MATERIALS ELECTRONICS CO.,LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059471/0737 →
Merger
Feb 3, 2023
From: LINCSTECH CO., LTD.
To: PTCJ-S HOLDINGS, CO., LTD.
Reel/Frame 062585/0259 →
Change of Name
Feb 3, 2023
From: PTCJ-S HOLDINGS, CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 062585/0300 →