Patent Assignment
Reel/Frame 021598/0313
Assignment of Assignor's Interest
Recorded: 2008-09-29
Pages: 3
Assignors
NISHIDA, TAKANORI
Executed: 2007-03-08
ISODA, SATOSHI
Executed: 2007-03-08
SUGIURA, RYOUJI
Executed: 2007-03-08
SAKURAI, MASAYUKI
Executed: 2007-03-16
Assignee
HITACHI AIC INC.
1-31-1, NISHIGOTANDA, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Chip-Type Light Emitting Device and Wiring Substrate for the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 22, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 059339/0621 →
Change of Name
Mar 22, 2022
From: HITACHI AIC INC.
To: HITACHI CHEMICAL ELECTRONICS CO., LTD.
Reel/Frame 059471/0471 →
Change of Name
Mar 22, 2022
From: HITACHI CHEMICAL ELECTRONICS CO., LTD.
To: SHOWA DENKO MATERIALS ELECTRONICS CO.,LTD.
Reel/Frame 059471/0614 →
Merger
Mar 22, 2022
From: SHOWA DENKO MATERIALS ELECTRONICS CO.,LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059471/0737 →
Merger
Feb 3, 2023
From: LINCSTECH CO., LTD.
To: PTCJ-S HOLDINGS, CO., LTD.
Reel/Frame 062585/0259 →
Change of Name
Feb 3, 2023
From: PTCJ-S HOLDINGS, CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 062585/0300 →