Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resin

1. An insulated coated wire comprising:

a wire;

a wire coating layer disposed around the wire, wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz; and

a wire adhesive layer disposed around the wire coating layer, wherein the wire adhesive layer is of one type of or a combination of two or more types of a fluorine resin or, a polyamide-imide resin having a relative permittivity of less than 3.6.

2. The insulated coated wire according to claim 1 , wherein the wire coating layer is of the one type or the combination of two or more types of a fluorine resin and the low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz.

3. The insulated coated wire according to claim 1 , wherein relative permittivity of the wire coating layer at 10 GHz is from 2.1 to 3.2 or relative permittivity of the wire adhesive layer at 10 GHz is from 2.6 to 3.2.

4. A multi-wire wiring board having a microstrip structure or a strip structure, comprising: the insulated coated wire according to claim 1 ; an insulation layer disposed around the insulated coated wire; and a conductor pattern disposed on the insulation layer.

5. A multi-wire wiring board having a strip structure, comprising: the insulated coated wire according to claim 1 ; an insulation layer disposed around the insulated coated wire; and conductor patterns disposed so as to face each other across the insulated coated wire with the insulation layer interposed therebetween.

6. A multi-wire wiring board having a strip structure, comprising:

an insulated coated wire comprising a wire, a wire coating layer disposed around the wire, wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz, and a wire adhesive layer disposed around the wire coating layer;

an insulation layer disposed around the insulated coated wire; and

conductor patterns disposed so as to face each other across the insulated coated wire with the insulation layer interposed therebetween.

7. The multi-wire wiring board according to claim 6 , wherein relative permittivity of the wire coating layer at 10 GHz is from 2.1 to 3.2 or relative permittivity of the wire adhesive layer at 10 GHz is from 2.6 to 3.2.

8. The multi-wire wiring board according to claim 6 , wherein the wire coating layer is of the one type or the combination of two or more types of a fluorine resin and the low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz.

9. An insulated coated wire comprising:

a wire;

a wire coating layer disposed around the wire, wherein the wire coating layer includes a polyamide-imide resin having a relative permittivity of less than 3.6 at 10 GHz; and

a wire adhesive layer disposed around the wire coating layer.

10. The insulated coated wire according to claim 9 , wherein relative permittivity of the wire coating layer at 10 GHz is from 2.1 to 3.2 or relative permittivity of the wire adhesive layer at 10 GHz is from 2.6 to 3.2.

11. A multi-wire wiring board having a microstrip structure or a strip structure, comprising: the insulated coated wire according to claim 9 ; an insulation layer disposed around the insulated coated wire; and a conductor pattern disposed on the insulation layer.