IP Library › Assignment 034550/0427
Patent Assignment
Reel/Frame 034550/0427

Assignment of Assignor's Interest

Recorded: 2014-12-18 Pages: 10
Assignors
CHENG, KANGGUO
Executed: 2014-12-11
ERVIN, JOSEPH
Executed: 2014-12-11
LI, JUNTAO
Executed: 2014-12-11
PEI, CHENGWEN
Executed: 2014-12-11
WANG, GENG
Executed: 2014-12-10
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method of Forming Semiconductor Fins on Soi Substrate
Patent: 9,530,701 →
Application: 14/575,602 →
Publication: US 2016/0181164
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052561/0161 →