Method of forming semiconductor fins on SOI substrate
An approach to forming fins for a semiconductor device on a silicon-on-insulator wafer. The approach includes depositing a layer of mandrel material and etching the layer of mandrel material to form a mandrel. The approach includes depositing a layer of a dielectric material on the semiconductor layer and around the mandrel and etching the layer of the dielectric material to form one or more spacers next to the sidewalls of the mandrel, followed by removing the mandrel. Additionally, the approach includes depositing a layer of amorphous semiconductor material around said one or more spacers and heating it to transform into a layer of re-crystallized semiconductor material through solid phase epitaxy. Furthermore, the approach includes removing portions of the layer of re-crystallized semiconductor material from each of the horizontal surfaces of the silicon-on-insulator wafer including the area where the one or more spacers were removed to form one or more fins.
1. A method for forming fins for a semiconductor device on a silicon-on-insulator (SOI) wafer, comprising:
depositing a dielectric layer on a semiconductor layer on the SOI wafer;
removing one or more portions of the dielectric layer;
depositing a layer of amorphous semiconductor material around one or more remaining portions of the dielectric layer;
heating and causing the layer of amorphous semiconductor material to transform into a layer of crystallized semiconductor material through solid phase epitaxy;
removing portions of the layer of crystallized semiconductor material from one or more top surfaces of the one or more remaining portions of the dielectric layer;
removing the one or more remaining portions of the dielectric layer, and
removing the semiconductor layer on the SOI wafer from an area where the one or more remaining portions of the dielectric layer was removed to form one or more fins of the crystallized semiconductor material.
2. The method of claim 1 , further comprising:
depositing a gate dielectric layer on the one or more formed fins, adjacent to the one or more formed fins, and on a top surface of the SOI wafer;
depositing a gate material layer on the gate dielectric layer; and
forming, using etching processes, one or more gates on the one or more formed fins.
3. The method of claim 2 , further comprising:
forming one or more of: a source, a drain and a contact on each of the one or more fins; and
forming a finFET device utilizing the source, the drain and the contact on each of the one or more fins.
4. The method of claim 1 , wherein the deposited layer of amorphous semiconductor material and the semiconductor later have a same material composition.
5. The method of claim 1 , wherein the deposited layer of amorphous semiconductor material and the semiconductor layer are composed of silicon.
6. The method of claim 1 , wherein the layer of crystallized semiconductor material is formed with a same material composition and a same lattice structure as the semiconductor layer of the SOI wafer.
7. The method of claim 1 , wherein the one or more fins of the crystallized semiconductor material each have a thickness of five to fifty nanometers.
8. A method for forming fins for a semiconductor device on a silicon-on-insulator (SOI) wafer, comprising:
depositing a dielectric layer on a semiconductor layer on the SOI wafer;
removing one or more portions of the dielectric layer;
depositing a layer of polycrystalline semiconductor material around one or more remaining portions of the dielectric layer, wherein the crystalline semiconductor material includes one of a single crystal semiconductor material and a polycrystalline semiconductor material;
heating and causing the layer of polycrystalline semiconductor material to transform into a layer of crystallized semiconductor material through solid phase epitaxy;
removing portions of the layer of crystallized semiconductor material from one or more top surfaces of the one or more remaining portions of the dielectric layer;
removing the one or more remaining portions of the dielectric layer, and
removing the semiconductor layer on the SOI wafer from an area where the one or more remaining portions of the dielectric layer was removed to form one or more fins of crystallized semiconductor material.
9. The method of claim 8 , wherein the deposited layer of crystalline semiconductor material and the semiconductor layer have a same material composition.
10. The method of claim 8 , wherein the layer of re-crystallized semiconductor material includes a same material composition and a same lattice structure as the semiconductor layer on the SOI wafer.
11. The method of claim 8 , wherein the one or more fins of the re-crystallized semiconductor material each have a thickness of approximately five to approximately fifty nanometers.
12. The method of claim 8 , further comprising:
depositing a gate dielectric layer on the one or more formed fins, adjacent to the one or more formed fins, and on a top surface of the SOI wafer;
depositing a gate material layer on the gate dielectric layer; and
forming, using etching processes, one or more gates on the one or more formed fins.
13. The method of claim 8 , wherein the deposited layer of crystalline semiconductor material and the semiconductor layer each include silicon.
14. A method for forming fins for a semiconductor device on a silicon-on-insulator (SOI) wafer, comprising:
depositing a dielectric layer on a semiconductor layer positioned on the SOI wafer;
removing one or more portions of the dielectric layer;
depositing a precursor semiconductor material around one or more remaining portions of the dielectric layer;
heating and causing precursor semiconductor material to transform into a layer of crystallized semiconductor material through solid phase epitaxy;
removing portions of the layer of crystallized semiconductor material from one or more top surfaces of the one or more remaining portions of the dielectric layer;
removing the one or more remaining portions of the dielectric layer, and
removing the semiconductor layer on the SOI wafer from an area where the one or more remaining portions of the dielectric layer was removed to form one or more fins of the crystallized semiconductor material.
15. The method of claim 14 , wherein the precursor semiconductor material comprises one of a single crystal semiconductor material, an amorphous semiconductor material, and a polycrystalline semiconductor material.
16. The method of claim 14 , wherein the deposited layer of precursor semiconductor material and the semiconductor layer have a same material composition.
17. The method of claim 14 , wherein the layer of crystallized semiconductor material includes a same material composition and a same lattice structure as the semiconductor layer on the SOI wafer.
18. The method of claim 14 , wherein the one or more fins of the crystallized semiconductor material each have a thickness of five to fifty nanometers.
19. The method of claim 14 , further comprising:
depositing a gate dielectric layer on the one or more formed fins, adjacent to the one or more formed fins, and on a top surface of the SOI wafer;
depositing a gate material layer on the gate dielectric layer; and
forming, using etching processes, one or more gates on the one or more formed fins.
20. The method of claim 14 , wherein the deposited layer of crystalline semiconductor material and the semiconductor layer each include silicon.