Patent Assignment
Reel/Frame 034552/0961
Assignment of Assignor's Interest
Recorded: 2014-12-18
Pages: 5
Assignors
LAN, JE-HSIUNG JEFFREY
Executed: 2014-10-28
ZHANG, WENYUE
Executed: 2014-11-19
DU, YANG
Executed: 2014-11-06
LEE, YONG JU
Executed: 2014-10-20
GU, SHIQUN
Executed: 2014-10-28
XIE, JING
Executed: 2014-10-30
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Microelectromechanical System (Mems) Bond Release Structure and Method of Wafer Transfer for Three-Dimensional Integrated Circuit (3D Ic) Integration