Patent Assignment
Reel/Frame 034597/0985
Assignment of Assignor's Interest
Recorded: 2014-12-30
Pages: 4
Assignors
CHEN, YAN-HENG
Executed: 2014-04-07
LIN, CHUN-TANG
Executed: 2014-04-07
CHI, CHIEH-YUAN
Executed: 2014-04-07
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Semiconductor Package and Fabrication Method Thereof and Carrier Structure