Patent Assignment
Reel/Frame 034614/0257
Assignment of Assignor's Interest
Recorded: 2015-01-02
Pages: 7
Assignors
MURATA, HITOSHI
Executed: 2014-08-22
KOSUGI, TETSUYA
Executed: 2014-08-22
UENO, MASAAKI
Executed: 2014-08-22
SUGISHITA, MASASHI
Executed: 2014-08-22
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Method of Processing Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.