IP Library › Assignment 034746/0097
Patent Assignment
Reel/Frame 034746/0097

Assignment of Assignor's Interest

Recorded: 2015-01-19 Pages: 2
Assignors
TSAI, PEI-CHUN
Executed: 2014-12-24
CHEN, YU-FENG
Executed: 2014-12-24
KUO, TIN-HAO
Executed: 2014-12-24
CHEN, CHEN-SHIEN
Executed: 2014-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Contact Area Design for Solder Bonding
Patent: 9,871,013 →
Application: 14/584,748 →
Publication: US 2016/0190082
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 18, 2017
From: TSAI, PEI-CHUN; CHEN, YU-FENG; KUO, TIN-HAO; CHEN, CHEN-SHIEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 043336/0355 →