IP Library › Assignment 043336/0355
Patent Assignment
Reel/Frame 043336/0355

Assignment of Assignor's Interest

Recorded: 2017-08-18 Pages: 4
Assignors
TSAI, PEI-CHUN
Executed: 2017-07-14
CHEN, YU-FENG
Executed: 2017-07-19
KUO, TIN-HAO
Executed: 2017-07-14
CHEN, CHEN-SHIEN
Executed: 2017-07-18
HUANG, YU-CHIH
Executed: 2017-07-14
WU, SHENG-YU
Executed: 2017-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Contact Area Design for Solder Bonding
Patent: 9,871,013 →
Application: 14/584,748 →
Publication: US 2016/0190082
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2015
From: TSAI, PEI-CHUN; CHEN, YU-FENG; KUO, TIN-HAO; CHEN, CHEN-SHIEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 034746/0097 →