IP Library › Assignment 034747/0240
Patent Assignment
Reel/Frame 034747/0240

Assignment of Assignor's Interest

Recorded: 2015-01-09 Pages: 10
Assignors
RYU, DONG SU
Executed: 2014-12-17
LEE, CHOON HEUNG
Executed: 2015-01-08
KIM, MIN HO
Executed: 2014-12-19
KIM, CHOONG HOE
Executed: 2015-01-07
YOON, JU HOON
Executed: 2015-01-07
HWANG, CHAN HA
Executed: 2015-01-07
JUNG, YANG GYOO
Executed: 2015-01-07
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property (1)
Laser Assisted Bonding for Semiconductor Die Interconnections
Patent: 9,627,348 →
Application: 14/592,571 →
Publication: US 2016/0049381
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →