Patent Assignment
Reel/Frame 034795/0408
Assignment of Assignor's Interest
Recorded: 2015-01-22
Pages: 15
Assignors
PAEK, JONG SIK
Executed: 2013-10-10
PARK, DOO HYUN
Executed: 2013-10-10
SEO, SEONG MIN
Executed: 2013-10-14
DO, WON CHUL
Executed: 2013-10-10
SUNG, PIL JE
Executed: 2013-10-10
PARK, JIN HEE
Executed: 2013-10-11
KIM, DO HYUNG
Executed: 2013-10-10
PARK, IN BAE
Executed: 2013-10-14
LEE, CHANG MIN
Executed: 2013-10-14
SONG, YONG
Executed: 2013-10-14
KANG, SUNG GEUN
Executed: 2013-10-14
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Semiconductor Device Utilzing Redistribution Layers to Couple Stacked Die
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →