Patent Assignment
Reel/Frame 034821/0555
Assignment of Assignor's Interest
Recorded: 2015-01-27
Pages: 5
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, 361-725, CHEONGJU-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Humidity Sensor with Void Within Interconnect and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.