Patent Assignment
Reel/Frame 034841/0704
Assignment of Assignor's Interest
Recorded: 2015-01-29
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-12-25
LO, HSIAOYUN
Executed: 2014-12-25
CHEN, YI-HSIU
Executed: 2014-12-25
CHIOU, WEN-CHIH
Executed: 2014-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chip-Stacking Apparatus Having a Transport Device Configured to Transport a Chip Onto a Substrate