Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate

1. A chip-stacking apparatus for stacking a chip on a substrate, comprising:

a substrate support configured to carry the substrate, and

a transport device configured to transport a chip onto the substrate, wherein the transport device comprises a bond head comprising:

a bond base;

an attaching element, mounted to the bond base, configured to attract the chip by a suction force, wherein a center area of the attaching element is higher than an edge area of the attaching element relative to the bond base; and

a pushing element disposed on the attaching element and located at a center area of the attaching element, wherein the pushing element is movable with respect to the attaching element for pushing the center area of the chip.

2. The chip-stacking apparatus as claimed in claim 1 , wherein the attaching element has a warped surface, and the chip is warped along the attaching surface when the chip is attached to the attaching element.

3. The chip-stacking apparatus as claimed in claim 2 , wherein the attaching element comprises an edge wall and a center wall disposed on the bond base, the edge wall is around the center wall, wherein the top surfaces of the edge wall and the center wall are a part of the warped surface.

4. The chip-stacking apparatus as claimed in claim 1 , wherein the transport device further comprises a vacuum pump coupled with the bond head, and the bond head generates the suction force to the chip by the vacuum pump.

5. The chip-stacking apparatus as claimed in claim 4 , wherein the attaching element has a vacuum hole located at the center area, and the bond head attracts the chip using the suction force via the vacuum hole.

6. The chip-stacking apparatus as claimed in claim 4 , wherein the attaching element has a plurality of vacuum holes located at the edge area, and the bond head attracts the chip using the suction force via the vacuum holes.

7. The chip-stacking apparatus as claimed in claim 1 , wherein the transport device further comprises a transport mechanism configured to move the bond head with the chip toward the substrate.

8. A chip-stacking apparatus for stacking a chip on a substrate, comprising:

a substrate support configured to carry the substrate;

a transport device configured to dispose a chip onto the substrate, wherein the transport device comprises a bond head comprising:

a bond base; and

an attaching element, comprising an edge area surrounding a center area and a plurality of vacuum holes located at the edge area, disposed on the bond base and configured to allow the chip to be attached thereon; and

a pushing element disposed on the attaching element and located at a center area of the attaching element, wherein the pushing element is movable with respect to the attaching element for pushing the center area of the chip; and

a vacuum pump, coupled with the bond head, configured to make the bond head having a suction force via the vacuum holes,

wherein the suction force of the bond head at the edge area is stronger than that of the center area.

9. The chip-stacking apparatus as claimed in claim 8 , wherein the attaching element comprises an attaching surface configured to allow the chip to be attached thereon, and the attaching surface is a flat surface.

10. The chip-stacking apparatus as claimed in claim 9 , wherein the center of the chip is separated from the attaching surface when the edge of the chip is attached to the attaching surface.

11. The chip-stacking apparatus as claimed in claim 8 , wherein the attaching element comprises an attaching surface, and the attaching surface is a warped surface which allows the chip warped along the warped surface when the chip is attached on the attaching element.

12. The chip-stacking apparatus as claimed in claim 8 , wherein the transport device further comprises a transport mechanism configured to move the bond head with the chip toward the substrate.

13. A chip-stacking apparatus, comprising:

a first cleaning device configured to clean a substrate;

a second cleaning device configured to clean a chip;

a chip-stacking device configured to stack the chip on the substrate; and

an alignment device configured to checking an offset between the chip and the substrate when the chip is stacked on the substrate, wherein the alignment device comprises:

a transport device;

an image sensor disposed on the transport device and configured to capture an image of the chip and the substrate when the chip is stacked on the substrate, and generate an image signal; and

a processor configured to determine the offset between the chip and the substrate according to the image signal.

14. The chip-stacking apparatus as claimed in claim 13 , wherein the first cleaning device further comprises a first dry-cleaning device configured to clean the substrate using plasma or gas, and a first wet-cleaning device configured to clean the substrate using liquid.

15. The chip-stacking apparatus as claimed in claim 13 , wherein the second cleaning device further comprises a second dry-cleaning device configured to clean the chip by plasma or gas and a second wet-cleaning device configured to clean the chip using liquid.

16. The chip-stacking apparatus as claimed in claim 13 , wherein the chip-stacking device further comprises a transport device configured to transfer the chip onto the substrate, wherein the transport device comprises a bond head comprising:

a bond base; and

an attaching element, disposed on the bond base, configured to allow the chip to be attached thereon; and

a pushing element disposed on the attaching element and located at a center area of the attaching element, wherein the pushing element is movable with respect to the attaching element for pushing the center area of the chip.

17. The chip-stacking apparatus as claimed in claim 16 , wherein the attaching element has a warped surface, and the chip is warped along the attaching surface when the chip is attached to the attaching element.

18. The chip-stacking apparatus as claimed in claim 16 , further comprising a chip-cleaning device configured to clean the chip when the chip is attached to the bond head.

19. The chip-stacking apparatus as claimed in claim 13 , further comprising a debonding device configured to separate the chip from the substrate if the chip is not aligned with the substrate.