Patent Assignment
Reel/Frame 034849/0171
Assignment of Assignor's Interest
Recorded: 2015-01-29
Pages: 8
Assignors
HO, KAI-KUANG
Executed: 2015-01-27
WANG, CHEN-HSIAO
Executed: 2015-01-27
HSU, YI-FENG
Executed: 2015-01-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure with Ubm Layer and Method of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.