Semiconductor structure with UBM layer and method of fabricating the same
View Patent ↗A semiconductor structure with an under bump metallization (UBM) layer is provided. The semiconductor structure at least includes a substrate, a metal pad disposed on the substrate, an insulating layer covering the substrate and an edge of the metal pad, wherein at least one recess is disposed within the insulating layer and a first UBM layer contacts the metal pad. The recess is adjacent to the metal pad and the recess is in the shape of a ring. The first UBM layer contacts part of the recess.
1. A semiconductor structure with an under bump metallization layer, comprising:
a substrate;
a metal pad disposed on the substrate;
an insulating layer covering the substrate and an edge of the metal pad;
at least one recess disposed within the insulating layer, wherein the recess is adjacent to the metal pad, and the recess is in a shape of a ring; and
a first under bump metallization layer contacting the metal pad, wherein the first under bump metallization layer contacts part of the recess.
2. The semiconductor structure with an under bump metallization layer of claim 1 , wherein the recess comprises a bottom and two sidewalls, and the first under bump metallization layer contacts one of the sidewalls and part of the bottom.
3. The semiconductor structure with an under bump metallization layer of claim 2 , wherein the first under bump metallization layer contacts the sidewalls and the entire bottom.
4. The semiconductor structure with an under bump metallization layer of claim 1 , wherein the first under bump metallization layer is a continuous metal structure.
5. The semiconductor structure with an under bump metallization layer of claim 1 , further comprising a plurality of recesses disposed within the insulating layer.
6. The semiconductor structure with an under bump metallization layer of claim 5 , wherein a recess which is relatively more distant from the metal pad surrounds a recess which is relatively nearer the metal pad.
7. The semiconductor structure with an under bump metallization layer of claim 5 , wherein each of the recesses comprises a bottom and two sidewalls, and the first under bump metallization layer contacts all of the sidewalls and all of the bottoms.
8. The semiconductor structure with an under bump metallization layer of claim 5 , wherein each of the recesses comprises a bottom and two sidewalls, the first under bump metallization layer contacts some of the bottoms and some of the sidewalls, and wherein a recess which is the most distant from the metal pad among all the recesses has at least one of the sidewalls not covered by the first under bump metallization layer.
9. A fabricating method of a semiconductor structure with an under bump metallization layer comprising:
providing a substrate;
forming a metal pad on the substrate;
forming an insulating layer covering the substrate and the metal pad;
performing a first patterning process to remove part of the insulating layer to expose the metal pad through the insulating layer;
performing a second patterning process to remove part of the insulating layer to form at least one recess adjacent to the metal pad within the insulating layer, wherein the recess is in a shape of a ring; and
forming an under bump metallization layer contacting the metal pad and filling part of the recess.
10. The fabricating method of a semiconductor structure with an under bump metallization layer of claim 9 , wherein when performing the second patterning process, a plurality of recesses are formed within the insulating layer and adjacent to the metal pad, and wherein among the recesses, a recess which is relatively more distant from the metal pad surrounds a recess which is relatively nearer the metal pad.
11. The fabricating method of a semiconductor structure with an under bump metallization layer of claim 9 , wherein the under bump metallization layer covers the recesses.