Patent Assignment
Reel/Frame 034861/0290
Assignment of Assignor's Interest
Recorded: 2015-02-01
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Method of Manufacturing the Same