Patent Assignment
Reel/Frame 034871/0884
Assignment of Assignor's Interest
Recorded: 2015-02-03
Pages: 10
Assignors
QIAN, BAINIAN
Executed: 2014-01-15
JAMES, DAVID B
Executed: 2013-11-08
MURNANE, JAMES
Executed: 2014-01-27
YEH, FENGJI
Executed: 2014-01-06
DEGROOT, MARTY W
Executed: 2014-01-16
ITAI, YASUYKI
Executed: 2013-12-11
NAKANO, HIROYUKI
Executed: 2013-12-06
KAWAI, NAOKO
Executed: 2013-12-11
KAWABATA, KATSUMASA
Executed: 2013-12-11
YOSHIDA, KOICHI
Executed: 2013-12-13
MIYAMOTO, KAZUTAKA
Executed: 2013-12-17
Assignees
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
NITTA HAAS INCORPORATED
4-4-26 SAKURAGAWA, NANIWA-KU, OSAKA-SHI, OSAKA, 556-0022, JAPAN
Covered Property
(1)
Method for Chemical Mechanical Polishing Silicon Wafers
Patent:
8,980,749 →
Application:
14/062,060 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 10, 2024
From: NITTA HAAS INC.
To: NITTA DUPONT INC.
Reel/Frame 068538/0982 →
Change of Name
Jun 27, 2025
From: NITTA HAAS INC.
To: NITTA DUPONT INCORPORATED
Reel/Frame 071542/0892 →
Change of Name
Jun 27, 2025
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 071765/0928 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →