Patent Assignment
Reel/Frame 068538/0982
Change of Name
Recorded: 2024-09-10
Pages: 8
Assignor
NITTA HAAS INC.
Executed: 2020-04-01
Assignee
NITTA DUPONT INC.
4-4-26 SAKURAGAWA, NANIWA-KU, OSAKA, JAPAN
Covered Properties
(2)
Method for Chemical Mechanical Polishing Silicon Wafers
Patent:
8,980,749 →
Application:
14/062,060 →
High Removal Rate Chemical Mechanical Polishing Pads and Methods of Making
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 3, 2015
From: QIAN, BAINIAN; JAMES, DAVID B; MURNANE, JAMES; YEH, FENGJI
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.; NITTA HAAS INCORPORATED
Reel/Frame 034871/0884 →
Assignment of Assignor's Interest
May 16, 2017
From: WILLUMSTAD, THOMAS P.; XIE, RUI; JACOB, GEORGE C.; DEGROOT, MARTY W.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.; DOW GLOBAL TECHNOLOGIES LLC; NITTA HAAS INCORPORATED
Reel/Frame 042392/0570 →
Change of Name
Jun 27, 2025
From: NITTA HAAS INC.
To: NITTA DUPONT INCORPORATED
Reel/Frame 071542/0892 →
Change of Name
Jun 27, 2025
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 071765/0928 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →