Patent Assignment
Reel/Frame 034890/0567
Assignment of Assignor's Interest
Recorded: 2015-02-04
Pages: 6
Assignors
RHEE, BONGHAE
Executed: 2015-01-27
JUNG, CHUNGHYO
Executed: 2015-01-27
CHOI, EUGENE
Executed: 2015-02-03
Assignees
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
TTM CO., LTD.
NO. C-3, 145, GWANGGYO-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Handheld Device with Heat Pipe