Handheld device with heat pipe
A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.
1. A handheld device comprising:
a circuit board including at least one electronic component;
a heat pipe disposed on the at least one electronic component, wherein the heat pipe comprises:
an evaporation section absorbs heat generated from the at least one electronic component,
a condensation section releases the absorbed heat in a direction opposite to the at least one electronic component,
a connection section provided on a side of the circuit board and structured with a bend at a predetermined angle from the evaporation section to an end of the condensation section,
a vapor cavity,
a wick surrounding the vapor cavity, and
a heat conductive member formed to surround the wick;
wherein the heat conductive member comprises at least one dummy region;
wherein a size of the vapor cavity or a size of the wick is determined depending on the at least one dummy region; and
a heat sinking material bonds the circuit board and the heat pipe to each other,
wherein the connection section is formed between the circuit board and an auxiliary board and is superposed with a side region of the circuit board facing a battery.
2. The handheld device of claim 1 , wherein the condensation section is disposed at a longer distance from the at least one electronic component than the evaporation section.
3. The handheld device of claim 1 , wherein:
the vapor cavity causes a phase change of a medium and transfer the medium subjected to the phase change to the condensation section; and
the wick surrounding the vapor cavity transfers the medium released from the condensation section to the evaporation section.
4. The handheld device of claim 3 , wherein the connection section is constituted with the heat conductive member.
5. The handheld device of claim 3 , wherein the heat conductive member is made of at least one of aluminum (Al), copper (Cu), silver (Ag), titanium (Ti), chrome (Cr), gold (Au), carbon (C), nickel (Ni), ferrite (Fe), platinum (Pt), graphite, and boron nitride (BN), or a combination thereof.
6. The handheld device of claim 1 , the heat conductive member comprises a dummy region expanded to a screw hole formed in the side region.
7. The handheld device of claim 6 , wherein the dummy region includes a slot hole.
8. The handheld device of claim 6 , wherein the dummy region is formed in at least one of a convex-concave shape, a polygonal shape, and a hole.
9. The handheld device of claim 1 , wherein the heat sinking material includes a Thermal Interface Material (TIM).
10. The handheld device of claim 9 , wherein the heat sinking interface material is made of Phase Change Material (PCM).
11. The handheld device of claim 10 , wherein the PCM is interposed between the circuit board and the heat pipe in a gel state.
12. The handheld device of claim 1 , wherein the circuit board is disposed on one of an upper side, a lower side, and a lateral side of a battery.
13. The handheld device of claim 1 , wherein the handheld device is one of a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), and an MP3 player.
14. The handheld device of claim 1 , further comprising an electronic component including a microprocessor.
15. The handheld device of claim 1 , wherein the at least one dummy region is formed where there is not enough space for the vapor cavity in a z-axis direction.
16. A handheld device comprising:
a main board on which a main processor is mounted;
an auxiliary board comprising at least one electronic component positioned opposite to the main processor; and
a heat pipe comprising:
an evaporation section disposed on the main processor and absorbs heat generated from the main processor;
a connection section disposed on a side region of the main board and structured with a bend at a predetermined angle from the evaporation section to an end of a condensation section, wherein the connection section transfers the absorbed heat in a direction opposite to the main processor; and
the condensation section releases the transferred heat in a direction opposite to the main processor;
wherein the heat pipe further comprises a vapor cavity, a wick surrounding the vapor cavity, and a heat conductive member formed to surround the wick;
wherein the heat conductive member comprises at least one dummy region; and
wherein a size of the vapor cavity or a size of the wick is determined depending on the at least one dummy region,
wherein the connection section is formed between the main board and an auxiliary board and is superposed with a side region of the main board facing a battery.
17. The handheld device of claim 16 , wherein the handheld device is one of a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), and an MP3 player.
18. The handheld device of claim 16 , wherein the at least one dummy region is formed in at least one of a convex-concave shape, a polygonal shape, and a hole.