IP Library Assignment 034933/0586
Patent Assignment
Reel/Frame 034933/0586

Assignment of Assignor's Interest

Recorded: 2015-02-10 Pages: 3
Assignors
ZHAI, JUN
Executed: 2015-02-06
HU, KUNZHONG
Executed: 2015-02-01
CARSON, FLYNN P.
Executed: 2015-02-06
Assignee
APPLE INC.
1 INFINITE LOOP, CUPERTINO, CALIFORNIA, 95014
Covered Property (1)
3D Integration of Fanout Wafer Level Packages
Patent: 9,589,936 →
Application: 14/619,002 →
Publication: US 2016/0148904