Patent Assignment
Reel/Frame 034987/0986
Assignment of Assignor's Interest
Recorded: 2015-02-19
Pages: 3
Assignor
LEE, KEVIN J.
Executed: 2011-09-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method for Handling Very Thin Device Wafers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.