Patent Assignment
Reel/Frame 035006/0703
Assignment of Assignor's Interest
Recorded: 2015-02-23
Pages: 4
Assignor
OI, SOTARO
Executed: 2014-02-04
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008117, JAPAN
Covered Property
(1)
Power-Module Substrate and Power Module