Power module substrate and power module
A power-module substrate includes first and second sets of circuit-layer metal-plates, a first ceramic substrate, a metal member connecting the first and second sets of circuit-layer metal-plates through a hole formed in the first ceramic substrate, a second ceramic substrate, a heat-radiation-layer metal-plate, and an electric component attached to a top surface of one of the first set of circuit-layer metal-plates above the metal member and the through hole. The power-module substrate is configured to conduct heat from the electric component through the through hole via the metal member, along the second set of circuit-layer metal-plates, and to the heat-radiation-layer metal-plate.
1. A power-module substrate, comprising:
first and second sets of circuit-layer metal-plates made of copper or copper alloy bonded in a layered state to top and bottom surfaces, respectively, of a first ceramic substrate;
a metal member connecting the first and second sets of circuit-layer metal-plates and extending through a hole formed in the first ceramic substrate;
a second ceramic substrate bonded at a top surface thereof to a bottom surface of the second set of circuit-layer metal-plates in the layered state;
a heat-radiation-layer metal-plate made of aluminum or aluminum alloy bonded to a bottom surface of the second ceramic substrate;
an electric component attached to a top surface of one of the first set of circuit-layer metal-plates above the metal member and the through hole;
a lead-terminal part for external connection protruding outward from the first ceramic substrate formed integrally on the second set of circuit-layer metal-plates; and
a protrusion part of the second ceramic substrate protruding outward from the first ceramic substrate in a surface direction and supporting at least a part of the lead-terminal part at a top surface thereof,
wherein the power-module substrate is configured to conduct heat from the electric component through the through hole via the metal member, along the second set of circuit-layer metal-plates, and to the heat-radiation-layer metal-plate.
2. The power-module substrate according to claim 1 , wherein the lead-terminal part for external connection protruding outward from the first ceramic substrate is formed integrally on the circuit-layer metal-plate at a middle stage disposed between the first ceramic substrate and the second ceramic substrate.
3. The power-module substrate according to claim 2 , wherein:
the protrusion part protruding outward from the first ceramic substrate is formed on the second ceramic substrate; and
at least a part of the lead-terminal part is supported on the protrusion part on the second ceramic substrate.
4. The power-module substrate according to claim 1 , wherein in a circuit layer at a middle stage formed between the first ceramic substrate and the second ceramic substrate, a hole part opening at an end of the circuit layer at the middle stage is formed.
5. The power-module substrate according to claim 2 , wherein in a circuit layer at the middle stage formed between the first ceramic substrate and the second ceramic substrate, a hole part opening at an end of the circuit layer at the middle stage is formed.
6. The power-module substrate according to claim 3 , wherein in a circuit layer at the middle stage formed between the first ceramic substrate and the second ceramic substrate, a hole part opening at an end of the circuit layer at the middle stage is formed.
7. A power module according to claim 1 , wherein the power-module substrate and the electric component are sealed by a resin mold except a surface of the heat-radiation-layer metal-plate.
8. A heat-sink-attached power module comprising:
the power-module substrate according to claim 1 ; and
a heat sink bonded to the heat-radiation-layer metal-plate of the power-module substrate, wherein:
the power-module substrate and the electric component are sealed by a resin mold; and
a part of the heat sink is covered with the resin mold.
9. A power module comprising the power-module substrate according to claim 2 , wherein the power-module substrate and the electric component are sealed by a resin mold except a surface of the heat-radiation-layer metal-plate.
10. A power module comprising the power-module substrate according to claim 3 , wherein the power-module substrate and the electric component are sealed by a resin mold except a surface of the heat-radiation-layer metal-plate.
11. A power module comprising the power-module substrate according to claim 4 , wherein the power-module substrate and the electric component are sealed by a resin mold except a surface of the heat-radiation-layer metal-plate.
12. A power module comprising the power-module substrate according to claim 5 , wherein the power-module substrate and the electric component are sealed by a resin mold except a surface of the heat-radiation-layer metal-plate.
13. A power module comprising the power-module substrate according to claim 6 , wherein the power-module substrate and the electric component are sealed by a resin mold except a surface of the heat-radiation-layer metal-plate.
14. A heat-sink-attached power module comprising:
the power-module substrate according to claim 2 ;
a heat sink bonded to the heat-radiation-layer metal-plate of the power-module substrate, wherein:
the power-module substrate and the electric component are sealed by a resin mold; and
a part of the heat sink is covered with the resin mold.
15. A heat-sink-attached power module comprising:
the power-module substrate according to claim 3 ;
a heat sink bonded to the heat-radiation-layer metal-plate of the power-module substrate, wherein:
the power-module substrate and the electric component are sealed by a resin mold; and
a part of the heat sink is covered with the resin mold.
16. A heat-sink-attached power module comprising:
the power-module substrate according to claim 4 ;
a heat sink bonded to the heat-radiation-layer metal-plate of the power-module substrate, wherein:
the power-module substrate and the electric component are sealed by a resin mold; and
a part of the heat sink is covered with the resin mold.
17. A heat-sink-attached power module comprising:
the power-module substrate according to claim 5 ;
a heat sink bonded to the heat-radiation-layer metal-plate of the power-module substrate, wherein:
the power-module substrate and the electric component are sealed by a resin mold; and
a part of the heat sink is covered with the resin mold.
18. A heat-sink-attached power module comprising:
the power-module substrate according to claim 6 ;
a heat sink bonded to the heat-radiation-layer metal-plate of the power-module substrate, wherein:
the power-module substrate and the electric component are sealed by a resin mold; and
a part of the heat sink is covered with the resin mold.