Patent Assignment
Reel/Frame 035098/0990
Assignment of Assignor's Interest
Recorded: 2015-03-06
Pages: 6
Assignors
WON, SEOK-JUN
Executed: 2015-03-02
KIM, WEON-HONG
Executed: 2015-03-02
SONG, MOON-KYUN
Executed: 2015-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Semiconductor Devices, Including Performing a Heat Treatment After Forming a Metal Layer and a High-K Layer