Methods of forming semiconductor devices, including performing a heat treatment after forming a metal layer and a high-k layer

1. A method for fabricating a semiconductor device, the method comprising:

forming an interlayer insulating layer comprising a trench therein on a substrate;

forming an interface layer in the trench;

forming a high-k layer in the trench,

wherein the high-k layer is on the interface layer and extends on a sidewall of the trench;

forming a first metal layer on the high-k layer,

wherein the first metal layer extends on the sidewall of the trench, and

wherein the first metal layer comprises an oxidized portion;

performing a first heat treatment with respect to the high-k layer and the first metal layer at a first temperature when a surface of the first metal layer is exposed,

wherein the first heat treatment reduces oxygen in the oxidized portion of the first metal layer;

performing a second heat treatment using a peak second temperature that is higher than the first temperature with respect to the high-k layer when the surface of the first metal layer is exposed,

wherein the second heat treatment diffuses oxygen from the first metal layer into the high-k layer;

forming a second metal layer on the first metal layer; and

forming a gate electrode structure on the second metal layer.

2. The method of claim 1 , wherein performing the second heat treatment comprises maintaining the peak second temperature for about 100 microseconds to about 1 second.

3. The method of claim 2 ,

wherein the peak second temperature comprises about 800° C. to about 1200° C., and

wherein performing the second heat treatment comprises performing the second heat treatment using the peak second temperature of about 800° C. to about 1200° C.

4. The method of claim 1 ,

wherein the first metal layer comprises metal nitride, and

wherein forming the first metal layer comprises forming the metal nitride on the high-k layer.

5. The method of claim 4 , wherein the metal nitride comprises Titanium Nitride (TiN), Tantalum Nitride (TaN), Tungsten Nitride (WN), or a combination thereof.

6. The method of claim 4 , wherein the second metal layer comprises a material that is different from the metal nitride of the first metal layer.

7. The method of claim 1 , wherein performing the first heat treatment comprises performing the first heat treatment using ammonia (NH 3 ) gas.

8. The method of claim 7 , wherein the first heat treatment is performed at a temperature of about 500° C. to about 700° C.

9. The method of claim 1 , wherein performing the first heat treatment comprises performing the first heat treatment using nitrogen (N 2 ) plasma.

10. The method of claim 1 , wherein the second heat treatment diffuses oxygen from the first metal layer into a first portion of the high-k layer on the interface layer and into a second portion of the high-k layer extending on the sidewall of the trench.

11. The method of claim 10 , wherein the high-k layer extends on the interlayer insulating layer beside the trench,

wherein the second heat treatment diffuses oxygen from the first metal layer into a third portion of the high-k layer on the interlayer insulating layer, the method further comprising:

after forming the gate electrode structure on the second metal layer, removing the third portion of the high-k layer.

12. A method for fabricating a semiconductor device, the method comprising:

providing a substrate that comprises a first region and a second region;

forming an interlayer insulating layer that comprises a first trench and a second trench on the first region and the second region, respectively;

forming a high-k layer in the first trench and the second trench;

forming a first metal layer on the high-k layer,

wherein the first metal layer comprises a first segment in the first region and a second segment in the second region, and

wherein the first metal layer comprises an oxidized portion;

performing a first heat treatment with respect to the high-k layer at a first temperature when a surface of the first metal layer is exposed,

wherein the first heat treatment reduces oxygen in the oxidized portion of the first metal layer;

performing a second heat treatment using a peak second temperature that is higher than the first temperature with respect to the high-k layer when the surface of the first metal layer is exposed,

wherein the second heat treatment diffuses oxygen from the first metal layer into the high-k layer;

forming a second metal layer on the first metal layer; and

removing the second metal layer from the first segment of the first metal layer in the first region while at least a portion of the second metal layer remains on the second segment of the first metal layer in the second region.

13. The method of claim 12 , further comprising forming an etch protection layer that comprises Tantalum Nitride (TaN), on the first metal layer in the first and second regions, before forming the second metal layer,

wherein forming the second metal layer comprises forming the second metal layer on the etch protection layer of the first and second regions, and

wherein removing the second metal layer comprises selectively removing the second metal layer from the first region by wet etching.

14. The method of claim 13 ,

wherein the second metal layer comprises a first conductivity type work function adjustment layer, and

wherein the method further comprises forming a second conductivity type work function adjustment layer on the etch protection layer of the first region and the second metal layer of the second region.

15. The method of claim 14 ,

wherein the first conductivity type comprises P-type, and

wherein the second conductivity type comprises N-type.

16. A method of forming a semiconductor device, the method comprising:

forming an interface layer in a trench in an insulating layer;

forming a high-k layer on the interface layer in the trench;

forming a metal layer on the high-k layer in the trench,

wherein the metal layer extends on a sidewall of the trench, and

wherein the metal layer comprises an oxidized portion;

performing a first heat treatment using a first temperature, after forming the metal layer on the high-k layer in the trench,

wherein the first heat treatment reduces oxygen in the oxidized portion of the metal layer; and

performing a second heat treatment using a second temperature that is higher than the first temperature of the first heat treatment, after performing the first heat treatment,

wherein the second heat treatment diffuses oxygen from the metal layer into the high-k layer.

17. The method of claim 16 ,

wherein the second temperature comprises a peak temperature of about 800° C. to about 1200° C., and

wherein performing the second heat treatment comprises performing the second heat treatment using the peak temperature of about 800° C. to about 1200° C. for about 100 microseconds to about 1 second.

18. The method of claim 16 ,

wherein the metal layer comprises a first metal layer, and

wherein the method further comprises:

forming a second metal layer in the trench after performing the first and second heat treatments;

forming a P-type work function adjustment layer after forming the second metal layer; and

forming an N-type work function adjustment layer on the P-type work function adjustment layer.

19. The method of claim 16 ,

wherein the trench comprises a first trench,

wherein the semiconductor device further comprises a second trench in the insulating layer,

wherein the metal layer comprises a first metal layer, and

wherein the method further comprises:

forming a second metal layer in the first and second trenches; and

completely removing the second metal layer from the first trench without completely removing the second metal layer from the second trench.

20. The method of claim 16 , wherein the high-k layer extends on the sidewall of the trench, and

wherein the second heat treatment diffuses oxygen from the first metal layer into a first portion of the high-k layer on the interface layer and into a second portion of the high-k layer extending on the sidewall of the trench.