IP Library › Assignment 035130/0559
Patent Assignment
Reel/Frame 035130/0559

Assignment of Assignor's Interest

Recorded: 2015-03-10 Pages: 7
Assignors
ISHIZAKA, TADAHIRO
Executed: 2015-02-27
SAKUMA, TAKASHI
Executed: 2015-03-03
YOKOYAMA, OSAMU
Executed: 2015-02-27
MATSUMOTO, KENJI
Executed: 2015-03-04
CHANG, PENG
Executed: 2015-03-04
NAGAI, HIROYUKI
Executed: 2015-03-04
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property (1)
Method of Forming Copper Wiring
Patent: 9,362,166 →
Application: 14/642,331 →
Publication: US 2015/0262872