Patent Assignment
Reel/Frame 035174/0666
Assignment of Assignor's Interest
Recorded: 2015-03-16
Pages: 3
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
9740 IRVINE BOULEVARD, SUITE D700, IRVINE, CALIFORNIA, 92618
Covered Property
(1)
Chip-On-Heatsink Light Emitting Diode Package and Fabrication Method
Patent:
9,324,697 →
Application:
14/659,029 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 16, 2015
From: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
To: TOSHIBA CORPORATION
Reel/Frame 035174/0706 →
Assignment of Assignor's Interest
Jan 24, 2020
From: TOSHIBA CORPORATION
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051604/0824 →
Assignment of Assignor's Interest
Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →