IP Library › Assignment 035174/0706
Patent Assignment
Reel/Frame 035174/0706

Assignment of Assignor's Interest

Recorded: 2015-03-16 Pages: 3
Assignor
Assignee
TOSHIBA CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property (1)
Chip-On-Heatsink Light Emitting Diode Package and Fabrication Method
Patent: 9,324,697 →
Application: 14/659,029 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2015
From: LIN, CHAO-KUN; HAMAGUCHI, NORIHITO
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 035174/0666 →
Assignment of Assignor's Interest Jan 24, 2020
From: TOSHIBA CORPORATION
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051604/0824 →
Assignment of Assignor's Interest Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →