Patent Assignment
Reel/Frame 035186/0213
Assignment of Assignor's Interest
Recorded: 2015-03-17
Pages: 5
Assignors
STROTHMANN, THOMAS J.
Executed: 2015-02-20
YOON, SEUNG WOOK
Executed: 2015-03-16
LIN, YAOJIAN
Executed: 2015-03-16
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.