Patent Assignment
Reel/Frame 035392/0618
Assignment of Assignor's Interest
Recorded: 2015-04-09
Pages: 8
Assignors
LIOU, EN-CHIUAN
Executed: 2015-04-01
TUNG, YU-CHENG
Executed: 2015-04-01
YANG, CHIH-WEI
Executed: 2015-04-01
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Metal Interconnect Structure and Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.