Patent Assignment
Reel/Frame 035410/0929
Assignment of Assignor's Interest
Recorded: 2015-04-15
Pages: 2
Assignors
CHEN, DING-YUAN
Executed: 2009-08-03
YU, CHEN-HUA
Executed: 2009-08-03
CHIOU, WEN-CHIH
Executed: 2009-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Novel Semiconductor Package with Through Silicon Vias
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 035411/0064 →
Change of Name
Dec 3, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037208/0159 →
Merger
Dec 3, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037457/0493 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →