Patent Assignment
Reel/Frame 035411/0064
Assignment of Assignor's Interest
Recorded: 2015-04-15
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH RD., HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Novel Semiconductor Package with Through Silicon Vias
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2015
From: CHEN, DING-YUAN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 035410/0929 →
Change of Name
Dec 3, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037208/0159 →
Merger
Dec 3, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037457/0493 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →