Patent Assignment
Reel/Frame 035412/0836
Assignment of Assignor's Interest
Recorded: 2015-04-15
Pages: 8
Assignors
LAMBERT, DAMIEN
Executed: 2015-03-25
SPANN, JOHN
Executed: 2015-03-31
KRASULICK, STEPHEN
Executed: 2015-03-30
Assignee
SKORPIOS TECHNOLOGIES, INC.
5600 EUBANK BOULEVARD NE, SUITE 200, ALBUQUERQUE, NEW MEXICO, 87111
Covered Property
(1)
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
Patent:
9,209,142 →
Application:
14/562,169 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.