IP Library Assignment 044272/0557
Patent Assignment
Reel/Frame 044272/0557

Security Interest

Recorded: 2017-10-23 Pages: 14
Assignor
SKORPIOS TECHNOLOGIES, INC.
Executed: 2017-10-02
Assignee
PACIFIC WESTERN BANK
406 BLACKWELL STREET, SUITE 240, DURHAM, NORTH CAROLINA, 27701
Covered Properties (62)
Integrated Multistage Taper Coupler for Waveguide to Fiber Coupling
High-Order-Mode Filter for Semiconductor Waveguides
Directional Semiconductor Waveguide Coupler
Waveguide Mode Expander Using Amorphous Silicon
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
Axial Alignment of a Lensed Fiber in a Silica V-Groove
Vertical Output Couplers for Photonic Devices
Broadband High-Speed Wavelength-Division Multiplexed Receiver Using Multiple Photodetectors Per Channel
Semiconductor Layer Variation for Substrate Removal After Bonding
Method and System for Widely Tunable Laser
High-Speed Optical Transmitter with a Silicon Substrate
Stepped Optical Bridge for Connecting Semiconductor Waveguides
Broadband Back Mirror for a Iii-V Chip in Silicon Photonics
Method and System of Heterogeneous Substrate Bonding for Photonic Integration
Patent: 8,630,326 →
Application: 12/902,621 →
Publication: US 2011/0085577
Method and System for Hybrid Integration of a Tunable Laser
Patent: 8,615,025 →
Application: 12/903,025 →
Publication: US 2011/0085572
Method and System for Hybrid Integration of a Tunable Laser and a Mach Zehnder Modulator
Patent: 8,605,766 →
Application: 13/040,154 →
Publication: US 2012/0057609
Method and System for Hybrid Integration of a Tunable Laser and a Phase Modulator
Patent: 8,559,470 →
Application: 13/040,179 →
Publication: US 2012/0057610
Method and System for Hybrid Integration of a Tunable Laser for a Cable Tv Transmitter
Patent: 8,867,578 →
Application: 13/040,181 →
Publication: US 2012/0057079
Method and System for Heterogeneous Substrate Bonding of Waveguide Receivers
Patent: 8,611,388 →
Application: 13/040,184 →
Publication: US 2012/0057816
Method and System for Hybrid Integration of an Opto-Electronic Integrated Circuit
Patent: 8,368,995 →
Application: 13/076,205 →
Publication: US 2011/0267676
Method and System for Template Assisted Wafer Bonding
Patent: 8,222,084 →
Application: 13/112,142 →
Publication: US 2012/0149148
Systems and Methods for Photonic Polarization Beam Splitters
Patent: 9,091,813 →
Application: 13/491,360 →
Publication: US 2013/0142474
Systems and Methods for Photonic Polarization Rotators
Patent: 9,453,965 →
Application: 13/491,389 →
Publication: US 2013/0142475
Systems and Methods for Photonic Polarization-Separating Apparatuses for Optical Network Applications
Patent: 9,170,373 →
Application: 13/491,395 →
Publication: US 2013/0142476
Method and System for Template Assisted Wafer Bonding
Patent: 8,445,326 →
Application: 13/527,394 →
Publication: US 2012/0264256
Integrated Waveguide Coupler
Patent: 9,097,846 →
Application: 13/597,117 →
Publication: US 2013/0051727
Tunable Hybrid Laser with Carrier-Induced Phase Control
Patent: 9,318,868 →
Application: 13/605,633 →
Publication: US 2013/0235890
Tunable Reflectors Based on Multi-Cavity Interference
Patent: 9,116,293 →
Application: 13/608,920 →
Publication: US 2013/0243362
Tunable Bi-Directional Transceiver
Patent: 9,287,984 →
Application: 13/722,132 →
Publication: US 2013/0183044
Method and System for Multiple Resonance Interferometer
Patent: 9,151,592 →
Application: 13/733,331 →
Publication: US 2013/0188969
Method and System for Template Assisted Wafer Bonding Using Pedestals
Patent: 8,735,191 →
Application: 13/733,337 →
Publication: US 2013/0189804
Vertical Integration of Cmos Electronics with Photonic Devices
Patent: 8,859,394 →
Application: 13/745,577 →
Publication: US 2013/0210214
Method and System for Forming a Membrane Over a Cavity
Patent: 9,184,094 →
Application: 13/750,163 →
Multi-Port Optical Circulator System
Patent: 8,942,516 →
Application: 13/838,596 →
Publication: US 2013/0251299
Hybrid Optical Modulator
Patent: 9,568,750 →
Application: 13/861,564 →
Publication: US 2013/0301975
Method and System for Template Assisted Wafer Bonding
Patent: 8,722,464 →
Application: 13/869,408 →
Publication: US 2013/0302920
Method and System for the Monolithic Integration of Circuits for Monitoring and Control of Rf Signals
Patent: 9,300,406 →
Application: 13/959,107 →
Publication: US 2014/0037286
Method and System for Performing Testing of Photonic Devices
Patent: 9,236,958 →
Application: 13/959,166 →
Publication: US 2014/0043050
Method and System for Optically Coupling a Waveguide and a Fiber
Patent: 9,268,096 →
Application: 14/049,053 →
Integrated Optical Network Unit
Patent: 9,337,933 →
Application: 14/057,844 →
Publication: US 2014/0112669
Method and System for Heterogeneous Substrate Bonding for Photonic Integration
Patent: 9,190,400 →
Application: 14/135,006 →
Publication: US 2014/0179036
Method and System for Template Assisted Wafer Bonding
Patent: 9,461,026 →
Application: 14/245,191 →
Publication: US 2014/0342500
Method and System for Template Assisted Wafer Bonding Using Pedestals
Patent: 9,159,631 →
Application: 14/261,276 →
Publication: US 2014/0342479
Method and System for Height Registration During Chip Bonding
Patent: 9,324,682 →
Application: 14/262,529 →
Publication: US 2014/0319656
Vertical Integration of Cmos Electronics with Photonic Devices
Patent: 9,659,993 →
Application: 14/482,650 →
Publication: US 2015/0123157
Method and System for Floating Grid Transceiver
Patent: 9,461,770 →
Application: 14/485,401 →
Publication: US 2015/0071639
Integration of an Unprocessed, Direct-Bandgap Chip into a Silicon Photonic Device
Patent: 9,316,785 →
Application: 14/509,914 →
Publication: US 2015/0098676
Coplanar Integration of a Direct-Bandgap Chip into a Silicon Photonic Device
Patent: 9,496,431 →
Application: 14/509,971 →
Publication: US 2015/0097210
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
Patent: 9,209,142 →
Application: 14/562,169 →
Multi-Port Optical Circulator System
Patent: 9,164,350 →
Application: 14/604,097 →
Publication: US 2015/0261064
Integrated Multistage Taper Coupler for Waveguide to Fiber Coupling
Patent: 9,625,651 →
Application: 14/615,942 →
Publication: US 2015/0219853
Directional Semiconductor Waveguide Coupler
Patent: 9,531,159 →
Application: 14/642,415 →
Publication: US 2015/0253501
High-Order-Mode Filter for Semiconductor Waveguides
Patent: 9,465,163 →
Application: 14/642,429 →
Publication: US 2015/0253472
Tunable Laser with Directional Coupler
Patent: 9,252,564 →
Application: 14/642,443 →
Publication: US 2015/0255952
Waveguide Mode Expander Having an Amorphous-Silicon Shoulder
Patent: 9,658,401 →
Application: 14/722,983 →
Publication: US 2015/0346430
Integrated Waveguide Coupler
Patent: 9,268,088 →
Application: 14/755,545 →
Publication: US 2015/0378097
Axial Alignment of a Lensed Fiber in a Silica V-Groove
Patent: 9,348,094 →
Application: 14/857,580 →
Method and System for Heterogeneous Substrate Bonding for Photonic Integration
Patent: 9,709,735 →
Application: 14/880,936 →
Publication: US 2016/0202415
Tunable Laser with Directional Coupler
Patent: 9,774,164 →
Application: 14/982,902 →
Publication: US 2016/0254647
Method and System for the Monolithic Integration of Circuits for Monitoring and Control of Rf Signals
Patent: 9,479,262 →
Application: 15/048,222 →
Publication: US 2016/0248516
Integrated Optical Network Unit
Patent: 9,686,015 →
Application: 15/096,017 →
Publication: US 2016/0294478
Wide Shoulder, High Order Mode Filter for Thick-Silicon Waveguides
Patent: 9,664,855 →
Application: 15/262,937 →
Publication: US 2017/0090118
Related Assignments (16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 12, 2010
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 025128/0183 →
Assignment of Assignor's Interest Oct 12, 2010
From: KRASULICK, STEPHEN B.; DALLESASSE, JOHN
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 025128/0204 →
Assignment of Assignor's Interest May 18, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026299/0844 →
Assignment of Assignor's Interest May 18, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026303/0233 →
Assignment of Assignor's Interest May 26, 2011
From: KRASULICK, STEPHEN B.; DALLESASSE, JOHN
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026346/0218 →
Assignment of Assignor's Interest May 26, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026346/0345 →
Assignment of Assignor's Interest Jul 14, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026589/0950 →
Assignment of Assignor's Interest Nov 9, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 027202/0720 →
Assignment of Assignor's Interest Aug 9, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028760/0783 →
Assignment of Assignor's Interest Aug 9, 2012
From: DALLESASSE, JOHN
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028768/0725 →
Assignment of Assignor's Interest Aug 10, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028769/0422 →
Assignment of Assignor's Interest Aug 22, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKOPRIOS TECHNOLOGIES, INC.
Reel/Frame 028831/0268 →
Assignment of Assignor's Interest Aug 28, 2012
From: MIZRAHI, AMIT; CREAZZO, TIMOTHY; MARCHENA, ELTON; VAN ORDEN, DEREK
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028863/0583 →
Release of Security Interest Nov 22, 2017
From: PACIFIC WESTERN BANK
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 044751/0469 →
Corrective Assignment to Correct the 2ND Inventor Name Previously Recorded at Reel: 028768 Frame: 0726. Assignor(S) Hereby Confirms the Assignment. Apr 4, 2018
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 045853/0175 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 028831 Frame: 0268. Assignor(S) Hereby Confirms the Assignment. Apr 4, 2018
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 045852/0927 →