IP Library › Assignment 045852/0927
Patent Assignment
Reel/Frame 045852/0927

Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 028831 Frame: 0268. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2018-04-04 Pages: 6
Assignors
DALLESASSE, JOHN
Executed: 2011-09-19
KRASULICK, STEPHEN B.
Executed: 2011-05-16
Assignee
SKORPIOS TECHNOLOGIES, INC.
5600 EUBANK BOULEVARD NE, SUITE 170, ALBUQUERQUE, NEW MEXICO, 87111
Covered Property (1)
Method and System for Template Assisted Wafer Bonding
Patent: 8,445,326 →
Application: 13/527,394 →
Publication: US 2012/0264256
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 22, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKOPRIOS TECHNOLOGIES, INC.
Reel/Frame 028831/0268 →
Security Interest Oct 23, 2017
From: SKORPIOS TECHNOLOGIES, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044272/0557 →
Release of Security Interest Nov 22, 2017
From: PACIFIC WESTERN BANK
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 044751/0469 →