Patent Assignment
Reel/Frame 044751/0469
Release of Security Interest
Recorded: 2017-11-22
Pages: 10
Assignor
PACIFIC WESTERN BANK
Executed: 2017-11-22
Assignee
SKORPIOS TECHNOLOGIES, INC.
7401 SNAPROLL STREET, NE, ALBUQUERQUE, NEW MEXICO, 87109
Covered Properties
(87)
Integrated Multistage Taper Coupler for Waveguide to Fiber Coupling
PCT:
PCT/US2015/014801 ↗
High-Order-Mode Filter for Semiconductor Waveguides
PCT:
PCT/US2015/019430 ↗
Directional Semiconductor Waveguide Coupler
PCT:
PCT/US2015/019482 ↗
Waveguide Mode Expander Using Amorphous Silicon
PCT:
PCT/US2015/032725 ↗
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
PCT:
PCT/US2015/048176 ↗
Axial Alignment of a Lensed Fiber in a Silica V-Groove
PCT:
PCT/US2016/023242 ↗
Vertical Output Couplers for Photonic Devices
PCT:
PCT/US2016/028431 ↗
Broadband High-Speed Wavelength-Division Multiplexed Receiver Using Multiple Photodetectors Per Channel
PCT:
PCT/US2016/047066 ↗
Semiconductor Layer Variation for Substrate Removal After Bonding
PCT:
PCT/US2016/052453 ↗
Method and System for Widely Tunable Laser
PCT:
PCT/US2016/055329 ↗
High-Speed Optical Transmitter with a Silicon Substrate
PCT:
PCT/US2017/016958 ↗
Stepped Optical Bridge for Connecting Semiconductor Waveguides
PCT:
PCT/US2017/016968 ↗
Broadband Back Mirror for a Iii-V Chip in Silicon Photonics
PCT:
PCT/US2017/016994 ↗
Method and System of Heterogeneous Substrate Bonding for Photonic Integration
Method and System for Hybrid Integration of a Tunable Laser
Method and System for Hybrid Integration of a Tunable Laser and a Mach Zehnder Modulator
Method and System for Hybrid Integration of a Tunable Laser and a Phase Modulator
Method and System for Hybrid Integration of a Tunable Laser for a Cable Tv Transmitter
Method and System for Heterogeneous Substrate Bonding of Waveguide Receivers
Method and System for Hybrid Integration of an Opto-Electronic Integrated Circuit
Method and System for Template Assisted Wafer Bonding
Systems and Methods for Photonic Polarization Beam Splitters
Systems and Methods for Photonic Polarization Rotators
Systems and Methods for Photonic Polarization-Separating Apparatuses for Optical Network Applications
Method and System for Template Assisted Wafer Bonding
Integrated Waveguide Coupler
Tunable Hybrid Laser with Carrier-Induced Phase Control
Tunable Reflectors Based on Multi-Cavity Interference
Tunable Bi-Directional Transceiver
Method and System for Multiple Resonance Interferometer
Method and System for Template Assisted Wafer Bonding Using Pedestals
Vertical Integration of Cmos Electronics with Photonic Devices
Method and System for Forming a Membrane Over a Cavity
Patent:
9,184,094 →
Application:
13/750,163 →
Optical Fiber Connection Architecture
Application:
13/767,310 →
Publication:
US 2013/0230285
Multi-Port Optical Circulator System
Hybrid Optical Modulator
Method and System for Template Assisted Wafer Bonding
Method and System for the Monolithic Integration of Circuits for Monitoring and Control of Rf Signals
Method and System for Performing Testing of Photonic Devices
Method and System for Optically Coupling a Waveguide and a Fiber
Patent:
9,268,096 →
Application:
14/049,053 →
Integrated Optical Network Unit
Method and System for Heterogeneous Substrate Bonding for Photonic Integration
Method and System for Template Assisted Wafer Bonding
Method and System for Template Assisted Wafer Bonding Using Pedestals
Method and System for Height Registration During Chip Bonding
Vertical Integration of Cmos Electronics with Photonic Devices
Method and System for Floating Grid Transceiver
Method and System for Hybrid Integration of a Tunable Laser
Application:
14/488,041 →
Publication:
US 2015/0139256
Integration of an Unprocessed, Direct-Bandgap Chip into a Silicon Photonic Device
Coplanar Integration of a Direct-Bandgap Chip into a Silicon Photonic Device
Processing of a Direct-Bandgap Chip After Bonding to a Silicon Photonic Device
Structures for Bonding a Direct-Bandgap Chip to a Silicon Photonic Device
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
Patent:
9,209,142 →
Application:
14/562,169 →
Multi-Port Optical Circulator System
Integrated Multistage Taper Coupler for Waveguide to Fiber Coupling
Directional Semiconductor Waveguide Coupler
High-Order-Mode Filter for Semiconductor Waveguides
Tunable Laser with Directional Coupler
Widely Tunable Laser Control
Waveguide Mode Expander Using Amorphous Silicon
Waveguide Mode Expander Having an Amorphous-Silicon Shoulder
Micro-Pillar Assisted Semiconductor Bonding
Integrated Waveguide Coupler
Tunable Reflectors Based on Multi-Cavity Interference
Axial Alignment of a Lensed Fiber in a Silica V-Groove
Patent:
9,348,094 →
Application:
14/857,580 →
Multilevel Template Assisted Wafer Bonding
Method and System for Heterogeneous Substrate Bonding for Photonic Integration
Semiconductor Bonding with Compliant Resin and Utilizing Hydrogen Implantation for Transfer-Wafer Removal
Method and System for Performing Testing of Photonic Devices
Tunable Laser with Directional Coupler
Integrated Waveguide Coupler
Method and System for the Monolithic Integration of Circuits for Monitoring and Control of Rf Signals
Integrated Photonics Mode Expander
Integration of an Unprocessed, Direct-Bandgap Chip into a Silicon Photonic Device
Integrated Optical Network Unit
Vertical Output Couplers for Photonic Devices
Back Side via Vertical Output Couplers
Axial Alignment of a Lensed Fiber in a Grooved Assembly
Broadband High-Speed Wavelength-Division Multiplexed Receiver Using Multiple Photodetectors Per Channel
Systems and Methods for Photonic Polarization Rotators
Wide Shoulder, High Order Mode Filter for Thick-Silicon Waveguides
Semiconductor Layer Variation for Substrate Removal After Bonding
Method and System for the Monolithic Integration of Circuits for Monitoring and Control of Rf Signals
Method and System for Widely Tunable Laser
Stepped Optical Bridge for Connecting Semiconductor Waveguides
Broadband Back Mirror for a Iii-V Chip in Silicon Photonics
Wide Shoulder, High Order Mode Filter for Thick-Silicon Waveguides
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 12, 2010
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 025128/0183 →
Assignment of Assignor's Interest
Oct 12, 2010
From: KRASULICK, STEPHEN B.; DALLESASSE, JOHN
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 025128/0204 →
Assignment of Assignor's Interest
May 18, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026299/0844 →
Assignment of Assignor's Interest
May 18, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026303/0233 →
Assignment of Assignor's Interest
May 26, 2011
From: KRASULICK, STEPHEN B.; DALLESASSE, JOHN
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026346/0218 →
Assignment of Assignor's Interest
May 26, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026346/0345 →
Assignment of Assignor's Interest
Jul 14, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.; KOZLOVSKY, WILLIAM
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 026589/0950 →
Assignment of Assignor's Interest
Nov 9, 2011
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 027202/0720 →
Assignment of Assignor's Interest
Aug 9, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028760/0783 →
Assignment of Assignor's Interest
Aug 9, 2012
From: DALLESASSE, JOHN
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028768/0725 →
Assignment of Assignor's Interest
Aug 10, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028769/0422 →
Assignment of Assignor's Interest
Aug 22, 2012
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKOPRIOS TECHNOLOGIES, INC.
Reel/Frame 028831/0268 →
Assignment of Assignor's Interest
Aug 28, 2012
From: MIZRAHI, AMIT; CREAZZO, TIMOTHY; MARCHENA, ELTON; VAN ORDEN, DEREK
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 028863/0583 →
Security Interest
Oct 23, 2017
From: SKORPIOS TECHNOLOGIES, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044272/0557 →
Corrective Assignment to Correct the 2ND Inventor Name Previously Recorded at Reel: 028768 Frame: 0726. Assignor(S) Hereby Confirms the Assignment.
Apr 4, 2018
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 045853/0175 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 028831 Frame: 0268. Assignor(S) Hereby Confirms the Assignment.
Apr 4, 2018
From: DALLESASSE, JOHN; KRASULICK, STEPHEN B.
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 045852/0927 →